ASML is one of the world’s leading manufacturers of chip-making equipment.
Our vision is to enable affordable microelectronics that improve the quality of life.
To achieve this, our mission is to invent, develop, manufacture and service advanced technology for high-tech lithography, metrology and software solutions for the semiconductor industry.
ASML's guiding principle is continuing Moore's Law towards ever smaller, cheaper, more powerful and energy-efficient semiconductors. This results in increasingly powerful and capable electronics that enable the world to progress within a multitude of fields, including healthcare, technology, communications, energy, mobility, and entertainment.
As an Imaging Engineer you will be a key player in developing applications to make the wafer pattern performance meet our customer's demands. You will be responsible for predicting, trouble-shooting and optimizing the pattern performance on actual product wafers.
Job Description
Our customers make computer chips. The final pattern performance on the wafer is important for the customer's yield. To meet the customer's demands control application are developed to optimize the imaging performance on the wafer by tuning scanner knobs.
To do so successfully we need to be able to characterize and control the variation of the pattern our customers intend to place on their wafers. The better we can control the pattern fidelity w.r.t design, the better the performance of our customers' chips.You will need to develop expertise in how both lithography and etch processes influence imaging performance.
As well as understand how different modelling, metrology sampling and measurement artefacts may influence your data and your conclusions. You will need to understand why and how imaging performance influences pattern fidelity.You will use this knowledge to define requirements for new and improved control functionalities, qualify and assess our new tools and facilitate an effective transfer to ASML's customer support group or to customers themselves.
You will also develop effective trouble-shooting processes. Are our latest products capable of what we predicted they would be capable of? If not, how come and how do we fix it as fast and as effective as possible? We will turn to you to answer these questions.
You will be part of a group of people with similar competencies, working together to lift their know-how to new levels year-after-year, making sure to be prepared for challenges ahead. You will contribute to roadmaps and competence management plans.You will also be part of an agile project team, working in a scrum-environment to meet a shared goal against challenging constraints.
Making test plans, carrying out analyses, reporting results and conclusions. Interface with other projects, marketing, customer support and customer themselves!Working at ASML as an Imaging Engineer is about being part of a dynamic, fast-paced community, facing unprecedented challenges at the forefront of technology together. You will find an open environment, offering myriad possibilities to take charge of your career, to be inspired, to have fun.
Keywords:
Optics, lithography, modelling, imaging, mathematics, physics, semiconductor industry, lithography, patterning, semiconductor process integration.
Solid technical background (MSc/PhD) in physics, optics, nano technology or related.
Experience
This position is available for candidates with >3-5 years' experience in the semiconductor industry, preferably in lithography, etch, process integration.
Personal skills
Please apply with your CV and cover letter by the 'apply' button below
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Education Backgrounds: |
Mechanical Engineering Micro / Nano Technology Physics |
Specialties: |
Fibers Laser/Photonics Material Science Optics Research (R&D) |
Education Level: |
Postgraduate (Masters) Doctorate (PH.D) |
Experience: |
0 - 2 years 2 - 5 years |
Languages spoken: |
English |
Job Location: | Veldhoven, Netherlands |
Keywords: | Optics, lithography, modelling, imaging, mathematics, physics, semiconductor industry, lithography, patterning, semiconductor process integration. |
Type: Job
Deadline: 1st August 2019
Job reference (ID): 11708
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