Sub-Project Lead for Installed Base Wafer Clamping Job in Veldhoven, Netherlands

ASML is one of the world’s leading manufacturers of chip-making equipment.

Our vision is to enable affordable microelectronics that improve the quality of life. To achieve this, our mission is to invent, develop, manufacture and service advanced technology for high-tech lithography, metrology and software solutions for the semiconductor industry.

ASML's guiding principle is continuing Moore's Law towards ever smaller, cheaper, more powerful and energy-efficient semiconductors. This results in increasingly powerful and capable electronics that enable the world to progress within a multitude of fields, including healthcare, technology, communications, energy, mobility, and entertainment.

Working at ASML
We provide the world’s top chipmakers everything they need to create better performing, cheaper semiconductor chips. Simply put: we are an industry leader supporting industry leaders.

As such, you’ll be encouraged to bring your best ideas and act on them. You’ll have the freedom, trust, and support in your field to experiment and solve complex challenges. Things are rarely dull when you’re constantly breaking new ground.

But despite our fast-paced environment at the forefront of tech, we take your work-life balance and wellbeing seriously. A business is only as good as its employees.

So join us, and you’ll be a part of a global collaboration. One that promotes creativity, the inclusion of highly diverse teams, and an exciting and dynamic work environment. Join us, and you’ll be a part of progress.

Sub-Project Lead for Installed Base Wafer Clamping Job Description

Introduction
Are you energized by being the driving force of a team, guiding them towards delivery of a wafer clamp that fulfills its customer expectations? 

Are you the one who is persistent in achieving these deliveries, has technical capability to understand our technical complex product and is capable to interact with people with different disciplines, levels, and cultural backgrounds?
Then we can offer you an attractive position as a main deliverable owner/sub-project lead (MDO/Sub-PL) in our wafer clamping project. Together with you and your team we develop and realize the product that holds the customer wafer in our ASML scanner: a great opportunity for your professional and personal growth.

Job Mission
As a Sub-Project Lead you are a member of the wafer clamping project and responsible for a subset of deliverables of this project. You will be responsible for the installed base project within wafer clamping. Main aspects are delivery of diagnostic software, implementation of the feedback loop for wafer clamping, solving air issues, and supporting issues that occur in field and factory. You do this by managing a small multidisciplinary team (< 10 FTE) on a daily basis and interacting with the other sectors, mainly in factory and field. Progress is reported to the project lead wafer clamping.

Job Description
The responsibilities of a Sub-PL/MDO within EUV wafer clamping group include:

• Planning and control: define and maintain a project plan to meet the agreed set of deliverables. Execute progress tracking and meet milestones at given timing and budget constraints. Technical alignment is done with the architects and system engineering.  You support the PL in preparation of the RFF process.
• Organization and team structure: set up effective team organization that reflects the work content , ensuring team is at right information level and interdependencies are identified and managed.
• Risk and escalation management: technical and non-technical risks for new deliveries will be evaluated by means of FMEAs. You understand the proper escalation paths and act accordingly. Solve problems/escalations with the team and lead the team.
• Communication: you will clearly communicate minutes of meetings with the team and sectors. You report progress of your project to PL and program and will assist the PL in progress reviews.
• Stakeholder management: As a clamp MDO you will interact with many internal and external stakeholders. Sectors you will interface with are factory, customer support, SE, marketing, and procurement.

Sub-Project Lead for Installed Base Wafer Clamping Job Requirements

Education

• Bachelor or Master Degree in Mechanical Engineering, Mechatronics, Physics or Electronics.

• At least 3 years of experience in a project leader role is a must.
• Experience in an industrial environment with high tech products and complex production processes in multi-disciplinary projects.
• Experience in leading a team of technical experts.
• Knowledge of ASML products and processes is a plus.

• Strong social and communication skills to build lasting relations and create an atmosphere of cooperation and trust.
• Solid technical background to understand and explain the technical challenges and solutions.
• Goal orientation: you show a high level of commitment to realize agreed objectives and take full ownership to overcome obstacles.
• Flexibility: you act with a high level of adaptation to changing circumstances and adjust your style of interaction to different (intercultural) teams and people.
• Self-reflects on own behavior and performance to identify strengths and development needs in skills or knowledge.
• Self-propelling: act pro-active, take initiative and always act to the greater good of the product such that they serve our customer needs. Excellent communication skills in speech and writing.

Sub-Project Lead for Installed Base Wafer Clamping Application Information

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Sub-Project Lead for Installed Base Wafer Clamping Summary

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