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    ASML - Sub Projectleader - Wafer Clamping Job in Veldhoven, Netherlands

    ASML is one of the world’s leading manufacturers of chip-making equipment.

    Our vision is to enable affordable microelectronics that improve the quality of life.

    To achieve this, our mission is to invent, develop, manufacture and service advanced technology for high-tech lithography, metrology and software solutions for the semiconductor industry.

    ASML's guiding principle is continuing Moore's Law towards ever smaller, cheaper, more powerful and energy-efficient semiconductors. This results in increasingly powerful and capable electronics that enable the world to progress within a multitude of fields, including healthcare, technology, communications, energy, mobility, and entertainment.

    ASML - Sub Projectleader - Wafer Clamping Job Description

    As a sub projectleader (Main Deliverable Owner/MDO) you are member of the wafer clamping project and responsible for a subset of deliverables of this project. You drive the development of the existing electrostatic wafer clamp and its future versions. You do this by managing a small multidisciplinary team (< 10 FTE) on a daily basis.

    As clamps are manufactured at Berliner Glas and ASML Wilton (USA) you will closely interact with people from these companies.In the end you will have completed your set of deliverables at the desired quality and within the given timing and budget constraints.

    Job Description
    The responsibilities of a  sub project leader Main Deliverable Owner (MDO) within EUV wafer clamping group consist of;

    • Plan and control: define and maintain a project plan to meet the agreed set of deliverables. Execute progress tracking and meet milestones at given timing and budget constraints. Technical alignment is done with the architects and system engineering. You support the Projectleader in preparation of the budgets process.
    • Organization and team structure: set up effective team organization that reflects the work content , ensuring team is at right information level and interdependencies are identified and managed
    • Risk and escalation management: technical and non-technical risks for new designs and processes will be evaluated by means of FMEAs. You will contribute to the IRR of the project. You understand the proper escalation paths and act accordingly. Solve problems/escalations with the team and lead the team
    • Communication: you will clearly communicate minutes of meetings with the team and suppliers. Progress of your project is summarized for easy reporting to PL and program and you assist the PL in progress reviews for your scope.
    • Stakeholder management: As a clamp MDO you will interact with many internal and external stakeholders. With attention to cultural differences you build a good relation with the teams in Berlin and Wilton who take care of the production of the clamp. Other sectors you will interface with are factory, customer support, research, SE, marketing, and procurement.
    Context of the position
    Within ASML the sector EUV is responsible for the development of ASML EUV scanner and source. The wafer clamping group is responsible to develop and deliver qualified electrostatic clamps which clamp the wafer onto the wafer stage. Wafer clamps are crucial to make lithography happen against the ever demanding specs on overlay, focus, defectivity and throughput while ensuring high availability.

    Within this group the wafer table cleaning functionality is also developed.The holder of this position reports to the Group lead ED EUV DE WCP Wafer Clamping and is operational within multidisciplinary projects.

    ASML - Sub Projectleader - Wafer Clamping Job Requirements

    Bachelor or Master Degree in Mechanical Engineering, Mechatronics, Physics or Electronics

    Experience

    • Experience in an industrial environment with high tech products and complex production processes in multi-disciplinary projects.
    • Experience in leading a team of technical experts. Project management experience is a pre
    Personal skills
    • Strong social and communication skills to build lasting relations and create an atmosphere of cooperation and trust
    • Solid technical background to understand and explain the technical challenges and solutions.
    • Goal orientation: you show a high level of commitment to realize agreed objectives and take full ownership to overcome obstacles.
    • Flexibility: you act with a high level of adaptation to changing circumstances and adjust your style of interaction to different (intercultural) teams and people.
    • Self-reflects on own behavior and performance to identify strengths and development needs in skills or knowledge.
    • Self-propelling: act pro-active, take initiative and always act to the greater good of the product such that they serve our customer needs.
    • Excellent communication skills in speech and writing
    • Willing to travel regularly

    ASML - Sub Projectleader - Wafer Clamping Application Information

    Please apply with your CV and cover letter by the 'apply' button below

    Remember - you found this opportunity on Qreer.com

    ASML - Sub Projectleader - Wafer Clamping Summary

    Education Backgrounds: Mathematics
    Mechanical Engineering
    Specialties: Mechanics
    Mechatronics
    Optics
    Education Level: Postgraduate (Masters)
    Experience: 0 - 2 years
    2 - 5 years
    Languages spoken: English
    Job Location: Veldhoven, Netherlands
    Keywords: Physics, Optics, Mechatronics, Mechanics

    Apply

    ASML Netherlands BV

    Veldhoven, Netherlands
    Resource center
    +31 40 268 3000
    View Company Profile More Jobs with

    Type: Job

    Deadline: 10th October 2017

    Job reference (ID): 12103

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