Project Description
Although sensors require a considerable amplification of the sensing element signal, the testability of some internal nodes is crucial for characterization purposes and final test. For this testability, it is important to bring out these internal nodes on one or more test pins of the package. The internal nodes are typically higher impedant and hence have low driving capabilities, so they need to be buffered before bringing them outside. The difficulty lies in the fact that the internal nodes can have any voltage, so the buffer should be a rail-torail operational, class AB type amplifier. With unity gain, stability is critical, again over the challenging temperature ranges intrinsic to the automotive market. Another important design constraint is the offset and offset drift: for accurate measurements, it is important to minimize these effects. Systematic offsets should be minimized through proper layout, but the random offset is governed by the matching and, through Lakshmikumar’s findings, the size –amongst others – of the input transistors. Proper scaling will have to be done to cover this aspect as well. Finally overvoltage protection should be in place as well, to survive harsh environments from production/application since it concerns circuitry directly exposed to the outside.
Project goals
In high quality mixed signal IC’s, testing of a lot of internal signals is required. The goal of this project is to design a rail-to-rail test buffer, capable of handling a wide range of load capacitances and working in the hostile automotive environment: -40C to 150C, EMC/ESD safe , …
Requirements
Please apply with your CV and cover letter by the 'apply' button below.
Education Backgrounds: |
Electrical Engineering |
Specialties: |
Analog Design Analog Power Supply Automotive Testing |
Education Level: |
Undergraduate (Bachelors) |
Experience: |
0 - 2 years |
Languages spoken: |
English |
Job Location: | Tessenderlo, Belgium |
Type: Internship
Deadline: 22nd July 2013
Job reference (ID): 5551
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