Electronic Packaging Engineer Job in Netherlands

Today, ATG is recognized as a leading provider of specialized engineering, scientific and technical services to the European Aerospace, High Tech and Offshore industry. Our headquarters is located in Noordwijk, The Netherlands and we have subsidiaries in Germany and the UK.

ATG People is the key player in delivering highly educated personnel for R&D environments throughout Europe. We are continually recruiting experienced Engineers for exciting, full time positions based at our customers. As an ATG Engineer, you will be working on very diverse missions and assignments. This opens up unique opportunities to be engaged in innovative projects and challenging you to perform to high standards and utilizing the full extent of your professional knowledge. We need you to complement our super star team!

Electronic Packaging Engineer Job Description

Customer and Location
Our customer is a world leader in lighting technologies. Position in The Netherlands.

Tasks and Responsibilities

• Support entire production line processes for packaging of optoelectronic components, including equipment specification, purchase and acceptance qualification;
• Support process improvements for yield and cost, including design input for manufacturability;
• Perform process analyses, including statistical analysis, FMEA, and process capability;
• Responsible for defining and enabling materials and process solutions to enable new product introduction;
• Investigate new capabilities, equipment and materials to find innovative ideas for more efficient manufacturing methods;
• Drive continuous improvement initiatives for materials, process and ideas for cost reduction;
• Implement programs to achieve production objectives to meet quality, cost and delivery commitments;
• Work with cross functional teams to implement new products and processes to meet project cost and schedule objectives;
• Work with manufacturing sites to resolve process and materials issues.

Electronic Packaging Engineer Job Requirements

Experience and Education

• University degree in mechanical engineering, electronic packaging engineering, material science or other related field;
• Minimum 5 years work experience in semiconductor packaging with process or equipment knowledge;
• Industry experience in microelectronic components and/or PCB assembly required;
• Experience with LED packaging is a big advantage;
• Knowledge of multiple packaging processes, including: die-bond (epoxy and eutectic), wire-bond (Au-ball), transfer mold, encapsulation, de-flash, trim & form, singulation, test;
• Knowledge of opto components and opto measurements preferred;
• Familiar with current state of the art microelectronic and chip-scale packaging technologies;
• Must have engineering knowledge of materials and process technologies used in these areas;
• Must have demonstrated, hands-on skill with finite-difference and FEA software for thermal analysis and mechanical integrity analysis as well board layout software;
• Fluent in English, both written and verbal;
• Willingness to travel.

Electronic Packaging Engineer Application Information

AOES Group B.V.
Advanced Operations and Engineering Services Huygensstraat 34 2201 DK Noordwijk (ZH) The Netherlands Tel +31 (0)71 5795 500 Fax +31 (0)71 5721 277 www.aoes.com

Interested?
Submit your CV and personal Motivation by the apply button. We encourage you to submit your CV in the Europass format.

Electronic Packaging Engineer Summary

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