Anodic Bond Process Engineer Job in Wilton - CT, United States

ASML is one of the world’s leading manufacturers of chip-making equipment.

Our vision is to enable affordable microelectronics that improve the quality of life. To achieve this, our mission is to invent, develop, manufacture and service advanced technology for high-tech lithography, metrology and software solutions for the semiconductor industry.

ASML's guiding principle is continuing Moore's Law towards ever smaller, cheaper, more powerful and energy-efficient semiconductors. This results in increasingly powerful and capable electronics that enable the world to progress within a multitude of fields, including healthcare, technology, communications, energy, mobility, and entertainment.

Working at ASML
We provide the world’s top chipmakers everything they need to create better performing, cheaper semiconductor chips. Simply put: we are an industry leader supporting industry leaders.

As such, you’ll be encouraged to bring your best ideas and act on them. You’ll have the freedom, trust, and support in your field to experiment and solve complex challenges. Things are rarely dull when you’re constantly breaking new ground.

But despite our fast-paced environment at the forefront of tech, we take your work-life balance and wellbeing seriously. A business is only as good as its employees.

So join us, and you’ll be a part of a global collaboration. One that promotes creativity, the inclusion of highly diverse teams, and an exciting and dynamic work environment. Join us, and you’ll be a part of progress.

Anodic Bond Process Engineer Job Description

Introduction
ASML brings together the most creative minds in science and technology to develop lithography machines that are key to producing faster, cheaper, more energy-efficient microchips. We design, develop, integrate, market and service these advanced machines, which enable our customers - the world’s leading chipmakers - to reduce the size and increase the functionality of their microchips, which in turn leads to smaller, more powerful consumer electronics. Our headquarters are in Veldhoven, the Netherlands, and we have 18 office locations around the United States including main offices in Wilton, CT, Chandler, AZ and San Jose, CA. 

Job Description

• Act as lead production engineer for anodic bond optical assembly process.
• Hands-on position requiring substantial amount of time spent in assembly labs directly involved in process.
• Oversee daily production work and interface directly with production technicians in decision making.
• Maintain assembly tools to ensure proper function and calibration.
• Develop processes and create work instructions to be used by assembly technicians. Initiate and optimize new procedures and adjust existing ones. Review processes created by other production engineers.
• Collect and analyze information in order to report timely required information to different users and management.
• Provide regular status reporting to applicable manufacturing departments in order to enable them to take required actions.
• Embrace the Lean Manufacturing philosophy and look for opportunities for continuous improvement in all areas of the production processes.
• Contribute to the good spirit of cooperation by finding solutions, execution of all kind of tasks and good communication. 

Anodic Bond Process Engineer Job Requirements

Education & Experience
BS degree – Electrical Engineering, Physics, Optics with strong work experience background (5+ years) or equivalent experience. 

Context of the position
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.　
　

• While performing the duties of this job, the employee routinely is required to sit; walk; talk; hear; use hands to keyboard, finger, handle, and feel; stoop, kneel, crouch, twist, reach, and stretch.　
• The employee is occasionally required to move around the campus.
• The employee may occasionally lift and/or move up to 20 pounds.　
• May require travel dependent on company needs.　
• Specific vision abilities required by this job include close vision, color vision, peripheral vision, depth perception, and ability to adjust focus.　
• Can work under deadlines.　
• The environment generally is moderate in temperature and noise level.　
• Must be able to read and interpret data, information, and documents.
• Can observe and respond to people and situations and interact with others encountered in the course of work.
• Can learn and apply new information or skills.

Anodic Bond Process Engineer Application Information

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Anodic Bond Process Engineer Summary

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