Material and Process architect Job in Veldhoven, Netherlands

ASML is one of the world’s leading manufacturers of chip-making equipment.

Our vision is to enable affordable microelectronics that improve the quality of life. To achieve this, our mission is to invent, develop, manufacture and service advanced technology for high-tech lithography, metrology and software solutions for the semiconductor industry.

ASML's guiding principle is continuing Moore's Law towards ever smaller, cheaper, more powerful and energy-efficient semiconductors. This results in increasingly powerful and capable electronics that enable the world to progress within a multitude of fields, including healthcare, technology, communications, energy, mobility, and entertainment.

Working at ASML
We provide the world’s top chipmakers everything they need to create better performing, cheaper semiconductor chips. Simply put: we are an industry leader supporting industry leaders.

As such, you’ll be encouraged to bring your best ideas and act on them. You’ll have the freedom, trust, and support in your field to experiment and solve complex challenges. Things are rarely dull when you’re constantly breaking new ground.

But despite our fast-paced environment at the forefront of tech, we take your work-life balance and wellbeing seriously. A business is only as good as its employees.

So join us, and you’ll be a part of a global collaboration. One that promotes creativity, the inclusion of highly diverse teams, and an exciting and dynamic work environment. Join us, and you’ll be a part of progress.

Material and Process architect Job Description

Introduction
The department Wafer Clamping & Particle Contamination Control is part of the EUV Business Line in ASML.  Its task is to specify, develop, integrate, qualify and industrialize wafer clamps, pellicles and particle contamination solutions in the area of EUV (Extreme Ultra Violet) Scanner Technology. The Pellicle group is part of this department. The holder of the position reports to the manager EUV Pellicle and is operational within multidisciplinary projects.
 
The group Pellicle is responsible for optimizing the EUV scanner performance by providing a membrane (pellicle) which can be applied in an EUV scanner. The membranes should increase the defectivity performance of an EUV scanner without having negative impact on other performance parameters. The ASML NXE systems must be made such that they can operate with an EUV pellicle on the reticle, to protect the reticle from particles. Because the pellicle is in the EUV light path spectral effects require another membrane in the light path, as a spectral filter.
Both the material stack and the processing of the pellicle and the spectral filter membrane are important to meet the product performance as defined for the various generations of membranes. 

Job Description
The DGLm Material and Process Architect should have extensive thin film technology knowledge and help to steer the process development of DGL membranes and the industrialization of the manufacturing process of these membranes.

This requires extensive process analysis and product-process relation investigations.The architect should be able to help the development and industrialization of deposition technologies for extremely thin layers/stacks, structuring of these layers while providing the desired functionality.The architect will also have a firm role in the interfacing with external suppliers/R&D partners of the membranes, as well as with related projects inside the company.

 

Material and Process architect Job Requirements

Education
Level University physics, material science or chemical engineering

Experience

• Has (>10 years) experience in an architect or technical leadership role
• Is familiar with “product research”, “product development” and “material development”, preferably within ASML.
• Ability to cover activities ranging from research phase, development phase, pilot production to ramp up in high volume production
• Very high knowledge level on thin film technology and materials (properties, processing, interfaces)
• Is familiar with a high tech production process, e.g. semiconductors, displays
• Working in a multi-disciplinary environment is a second nature
• Has extensive experience with thin film process development
• Lithography Scanner, source, vacuum systems experience is a pre
• Preferably has experience in a project where activities covered all the way from (a) supplier(s) to the end user

• Broad technical view, ability to oversee the impact of technical details on the product
• Can translate high level requirements into SMART work packages (including staffing and timing input)
• Able to drive forward the technical progress
• Good communication skills (verbal and written):
• Can get people on board (influencing without formal power/negotiating skills
• Can work independently in a dynamic, explorative environment
• Strong analytical ability with a pragmatic attitude
• Highly committed and flexible
• Robust personality -Willing to travel (USA, Asia) if needed
• Good knowledge of English language
• Driving license

Material and Process architect Application Information

Please apply with your CV and cover letter by the 'apply' button below

Remember - you found this opportunity on Qreer.com

Material and Process architect Summary

Apply